UP Xtreme i11 Edge Compute Enabling Kit
Intel certified Developer Kit, powered by Intel® SoC.
UP Xtreme i11 Edge Compute Enabling Kit
Unleashing the new UP Xtreme i11 Edge Compute Enabling Kit, powered by the 11th Gen Intel® Core™ processors with Iris® Xe graphics. It delivers greater performance and better efficiency for both general purpose applications and Artificial Intelligence (AI) on the edge. Leveraging the next generation network for IoT devices, this 5G enabled platform (with optional modem) can efficiently connect and collaborate between edge and the cloud.
With power-efficient compute and graphics, the UP Xtreme i11 Edge Compute Enabling Kit is optimized for speed, reliability, and efficiency. The integration of new Iris® Xe graphics boasts 96EUs, the most powerful integrated graphics available. It offers a strong set of features, in particular: 40Pin GPIO header, Dual Ethernet 1Gbps i219 plus 2.5 Gbps i225, multiple video output via HDMI 2.0b, DP 1.4, eDP, and Type-C USB.
NOTE: Please note that ADC is currently not working due to kernel regression (future kernel releases will fix the issue).
NOTE: Please note that the latest NVM for i225 IT Ethernet controller is not working in Ubuntu Linux. Please refer here for more info.
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Intel® Titanium Partner |
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Powerful The latest 11th Gen Intel® Core™ processor with Intel Iris Xe graphic (formerly Tiger Lake UP3) powers the UP Xtreme i11 Edge Compute Enabling Kit and clocks up to 4.4 GHz with only 28 watts TDP and 15 watts cTDP. Intel® Iris® Xe graphics provide up to 96EU, which is nearly twice the performance of corresponding Ice Lake Gen 11 at the same TDP. |
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Fast
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Expandable
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Industrial & Security
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AI Ready
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Production-ready computing system UP Xtreme i11 Edge Compute Enabling Kit is production-ready for multiple vertical markets for robotics, automation, retail, AI and IoT. The kit comes with Intel® Distribution of OpenVINO™ Toolkit pre-loaded to make your AI and computer vision application faster. It is also compatible with Intel® OneAPI, which is easy to install via command line. |
Board Details
Hardware overview
- UP Xtreme i11 Edge Compute Enabling Kit with the latest Intel® 11th Gen Core SoC, up to 4.4GHz
- Intel® UHD Graphics (Core™ i3) / Intel® Iris XE (Core™ i5 & i7)
Tech Specifications
UP Xtreme i11 Board Overview
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1) RTC battery connector |
14) 40-pin HAT connector |
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10) Power mode jumper |
15) DDR4 SO-DIMM |
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2) Gbps Ethernet port RJ-4 5 intel 225) |
16) Audio jack |
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3) Gbps Ethernet port RJ-45 intel 219) |
17) USB 4.0 (type C) + DP 14 |
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4) DisplayPort |
18) BIOS header |
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5) HDMI |
19) 10-pin RS232/422/485 header |
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6) USB Type A Dual Port(1x USB 3.2 Gen 2, 1x USB 2.0) |
20) 10-pin RS232/422/485 header |
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7) USB Type A Dual Port (2x USB 3.2 Gen 2) |
21) PCIE [x4] slot |
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8) Lockable 12V DC-IN |
22) M.2 3052 B key |
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9) AT/ATX Mode |
23) M.2 2230 E key |
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11) SATA |
24) Fan Connector |
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12) SATA power 5V/12V |
25) M.2 2280 M key (support NVME SSD) |
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13) Power pin-header |
26) CPU |
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System |
UP Xtreme i11 |
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SoC |
Intel® Core™ i7-1185GRE (up to 4.4 GHz) |
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Intel® Core™ i5-1145GRE (up to 4.1 GHz) |
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Intel® Core™ i3-1115GRE (up to 3.9 GHz) |
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Intel® Celeron® 6305E (up to 1.8 GHz) |
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# of Cores |
i3-1115GRE/ Celeron 6305E-Duo Core |
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i7-1185GRE/i5-1145GRE-Quad Core |
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Graphics |
Intel® Iris® Xe Graphics – i7-1185GRE/i5-1145GRE |
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Intel® UHD Graphics for 11th Gen Intel® Processors-i3-1115GRE/ Celeron 6305E |
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VPU |
Optional via M.2 2280 |
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FPGA |
Intel® FPGA Altera Max V for 40-pin GP-bus |
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System memory |
2x DDR4 2 channel SO-DIMM VERTICAL MAX 64GB @ 3200MT/s |
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Storage capacity |
via 1x SATA 3.0 CONN with POWER CONN / 1xM.2 2280 M key (combo 2x PCIE[x1]) NVME |
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RTC |
Yes |
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Wake-on-LAN (WoL) |
Yes |
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Watchdog timer |
Yes |
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PXE |
Yes |
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Compatible operating system |
Microsoft Windows 10 full version |
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Ubuntu 20.04 |
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Yocto project 3.0/3.1 Kernel 5.4 |
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Power |
12V DC-IN (lockable connector) |
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Power supply type |
AT/ATX (default AT mode) |
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Power consumption (typical) |
60W |
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Dimension (L x W) |
120 mm x 122mm |
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Operating temperature |
32°F ~ 140°F (0°C ~ 60°C) |
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Storage temperature |
-40°F ~ 176°F (-40°C ~ 80°C) |
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Operating humidity |
0% ~ 90% relative humidity, non-condensing |
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Certification |
CE/FCC Class A, RoHS compliant |
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Cooling |
Active Cooler |
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Others |
4 LEDs YRGB (under ethernet port) |
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1x power button |
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1x reset button |
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Accessories |
1x RTC battery |
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1x active heatsink |
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Country of origin |
Taiwan |
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Longevity |
2035 |
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Display |
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HDMI |
1 (HDMI 2.0b) |
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DP |
1x DP+ 1x USB Type C ( 1x DP 1.4/ USB4.0) |
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MIPI DSI/ eDP |
1 x eDP (4K@60hz) |
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I/O |
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Audio |
HDMI Audio x 1, DP Audio x 1, Soundwire Codec for Audio Out/Mic In/, I2S |
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USB |
3x USB 3.2 Gen 2 (Type A) |
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1x USB 2.0 |
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1x USB 4.0 (Type C) |
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UART |
1 x HSUART (pin header) |
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Serial port |
Fintek F81801,2x RS232/422/485 |
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HDD interface |
1 x SATA 3.0 |
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Expansion slot |
1x M.2 2280 M key (support NVME SSD) |
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1x M.2 2230 E key |
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1x M.2 3052 B key |
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1x PCI-E[X4] (adapter board accessory required) |
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40-pin GP-bus |
1 |
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AIO/DIO |
via GP bus |
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SIM slot |
1 |
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Others |
Infineon TPM SLB9670 on board |
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Connectivity |
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Ethernet |
1 x 1GbLAN (i219), 1x 2.5Gb LAN (i225), |
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*vPRO is only available in i7/i5 CPU |
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WiFi 5/6 |
Optional (via M.2 2230) — Intel® AC9260 card |
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Bluetooth |
Optional (via M.2 2230) — Intel® AC9260 card |
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LTE/4G/ 5G |
Optional (via M.2 3042/3052) |
Expansions
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Intel® Wireless-AC 9260 802.11ac, Bluetooth 5.0 |
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UP AI Core XM 2280 2x Myriad™ X VPUs |
What can you achieve with this kit?
UP Xtreme i11 Edge Compute Enabling Kit has a M.2 3052 slot to support 5G modules to enable ultra-low latency and reliable transmission of data to/from masses of IoT devices, which ensures the convergence of 5G, AI, Cloud Computing, Data Analytics, and IIOT.
Combined with Intel AI Accelerator and Intel® Distribution of OpenVINO™ toolkit, it accelerates Computer Vision (CV) and Deep Learning Inference from Edge to Cloud. It also offers pre-trained models, and pre-optimized kernels to increase performance for AI.
Everything gets smarter when 5G and AI are integrated. Gigabyte speed and access to massive amounts of data provides a good foundation for AI to evolve. Ultra reliable, low latency allows AI to seamlessly work within/with all IoT devices.
Vertical Markets
ROBOTICS
- I/O interfaces include USB 4.0 Type-C, USB 3.2 Type-A, Ethernet Controller i225, and HDMI 2.0b.
- 40-pin GP-bus gives the flexibilities to connect a variety of sensors and displays
- High computing and graphic capability with low power consumption, perfect for AMR
VISION
- Powerful CPU and VPU with improved communication capabilities
- Supports OpenVINO for improved AI in Object/intrusion detection, face recognition and monitoring
- 5G enabled for future Smart Homes and Cities
- Improved applications in AR and 3D Vision performance engines with faster GPU
INDUSTRIAL AUTOMATION
- 12 V DC input ready for industrial use
- TSN real-time network with support for TPM 2.0 and In-Band ECC
- Enables Massive Machine-Type Communication (mMTC)
- Ultra-Reliable Low Latency Communication with Enhanced Mobile Broadband (eMBB) via 5G
RETAIL
- Faster and more efficient video analytics to leverage end user’s shopping capabilities
- 5G enabled low latency communication for Drone deliveries
- AI and IoT enabled for better logistical operations
HEALTHCARE
- Future of healthcare with 5G for remote patient monitoring and telemedicine appointments
- IoT with healthcare via wearable devices
Block Diagram
