ET839 ETX module industrial large temperature (-40 ° C ~ + 85 ° C) and low heat dissipation efficiency and is ideal for use in supporting fanless applications in harsh environments. Platform independent from the chassis and thermal design, basic cards without replacing the existing Bay Trail-In ETX solution with a scalable performance that enables a simple way modified or upgraded, 1.91ghz quad-core Intel® Atom ™ Processor is supported by E3845 SoC.
ET839 ETX module, customers with different I / O interface design different carrier boards, connectors and special offers provide functionality and market penetration while reducing the needs for flexibility.
New ET839 (95 x 114mm), supports up to 8GB DDR3L an SO-DIMM system memory. Integrated graphics, respectively, with resolution up to 1600 x 1200 and 2048 x 24 bit dual channel LVDS 1536 and provides dual independent display via CRT graphical outputs. provides the
Product Code | ET839-I45 |
Form Factor | COM Express Compact Size |
Card Size (mm) | 95 x 95 |
Processor [CPU] | Intel® Atom™ E3845 4 Core 1.91 GHz BM: 1130 |
Processor [CPU] Family | Intel® Atom™ |
RAM [System Memory] | Upgradeable to 8 GB |
SSD / HDD / mSATA Storage | SATAII x 1 |
LAN/Ethernet | GbE x 1 |
USB 2.0 | x 4 |
RS-232 Serial Port | x 2 |
RS-232/422/485 serial port | x 2 |
Video Output | LVDS |
LVDS | 18/24 bit 2CH |
Audio Output | Line-in x 1 Line-Out x 1 |
Other Functions | D x 4 / DO x 4 |